Fuel Cell Sealant Compounds
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Report Number: WADC TR 52-230
Author(s): Sorg, Earl H., McCarthy, John F., Fettes, Edward M., Jorczak, Joseph S.
Corporate Author(s): Thiokol Corporation
Date of Publication: 1952-09
Pages: 138
DoD Task:
Identifier: AD0003231
AD Number: 3231
Abstract:
This work was undertaken by the Thiokol Corporation to develop integral fuel tank sealant compounds with improved low and high temperature properties, increased toughness and adhesion, and better resistance to jet fuels. Experimental integral fuel tank sealant compounds were prepared in two-package mixes from hexamethylene dichloride/triglycol dichloride/ formal and pentamethylene dicMoride/formal polymers. Compared to a Thiokol' LP-2 base sealant, these experimental compounds displayed improved low temperature properties, equivalent toughness and adhesion to aluminum, somewhat better resistance to heat aging at 2l20F, and slightly poorer resistance to swell in aromatic fuels. Compounding studies with Thiokol' LP-2 yielded formulations with improved adhesion properties and heat aging resistance. Development work on clear sealant compounds disclosed the possibility- of preparing sealants of this type from combinations 0% epoxide resins and Thiokol' liquid polymers; however, considerably more investigation of this aspect is required.
Author(s): Sorg, Earl H., McCarthy, John F., Fettes, Edward M., Jorczak, Joseph S.
Corporate Author(s): Thiokol Corporation
Date of Publication: 1952-09
Pages: 138
DoD Task:
Identifier: AD0003231
AD Number: 3231
Abstract:
This work was undertaken by the Thiokol Corporation to develop integral fuel tank sealant compounds with improved low and high temperature properties, increased toughness and adhesion, and better resistance to jet fuels. Experimental integral fuel tank sealant compounds were prepared in two-package mixes from hexamethylene dichloride/triglycol dichloride/ formal and pentamethylene dicMoride/formal polymers. Compared to a Thiokol' LP-2 base sealant, these experimental compounds displayed improved low temperature properties, equivalent toughness and adhesion to aluminum, somewhat better resistance to heat aging at 2l20F, and slightly poorer resistance to swell in aromatic fuels. Compounding studies with Thiokol' LP-2 yielded formulations with improved adhesion properties and heat aging resistance. Development work on clear sealant compounds disclosed the possibility- of preparing sealants of this type from combinations 0% epoxide resins and Thiokol' liquid polymers; however, considerably more investigation of this aspect is required.