Microcircuit Screening Effectiveness
Report Number: TRS-1
Author(s): Rickers, Henry C.
Corporate Author(s): Reliability Analysis Center (IIT Research Institute)
Laboratory: Reliability Analysis Center
Date of Publication: 1978
Pages: 117
Contract: F30602-78-C-0281
DoD Task:
Identifier: ADA063166
Abstract:
The purpose of this report is to broaden the readers awareness of the factors affecting the reliability of microelectronics through the application of screening techniques. The information compiled within this document should provide a valuable resource to those responsible for design, specification, testing and failure analysts of integrated circuits. This document is prepared as part of the Reliability Analysis Center's (RAC) continued responsibility to provide new information on the reliability of electronic devices. The bulk of the information reported herein has been obtained through an active data solicitation program. The reliability data related to component screening in this document have also been, or will be, reported in the RAC Data Publication Series. This report is one of a new series of documents being prepared by RAC treating topics of particular interest to the electronics industry. Other technical reports under preparation include: Failure Mechanisms of Microcircuit Metallizations Electrostatic Discharge Damage in Microcircuits The primary responsibility for the compilation and accuracy of this document rests with Mr. H. C. Rickers and the Reliability Analysis Center staff. However, equal credit must be given to the many people who performed the tests and took the time and effort to document their results.
Provenance: Motorola Mobility
Author(s): Rickers, Henry C.
Corporate Author(s): Reliability Analysis Center (IIT Research Institute)
Laboratory: Reliability Analysis Center
Date of Publication: 1978
Pages: 117
Contract: F30602-78-C-0281
DoD Task:
Identifier: ADA063166
Abstract:
The purpose of this report is to broaden the readers awareness of the factors affecting the reliability of microelectronics through the application of screening techniques. The information compiled within this document should provide a valuable resource to those responsible for design, specification, testing and failure analysts of integrated circuits. This document is prepared as part of the Reliability Analysis Center's (RAC) continued responsibility to provide new information on the reliability of electronic devices. The bulk of the information reported herein has been obtained through an active data solicitation program. The reliability data related to component screening in this document have also been, or will be, reported in the RAC Data Publication Series. This report is one of a new series of documents being prepared by RAC treating topics of particular interest to the electronics industry. Other technical reports under preparation include: Failure Mechanisms of Microcircuit Metallizations Electrostatic Discharge Damage in Microcircuits The primary responsibility for the compilation and accuracy of this document rests with Mr. H. C. Rickers and the Reliability Analysis Center staff. However, equal credit must be given to the many people who performed the tests and took the time and effort to document their results.
Provenance: Motorola Mobility