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The Effects Of Decreases In Stress On The Creep Behavior Of Polycrystalline Aluminum In The Dislocation Climb Region
Author(s): Raymond, L., Jaffe, N., Dorn, J. E., Ludemann, W.
Corporate Author(s): University Of California
Laboratory: Materials Central
Date of Publication: 1960-08
Report number: WADD TR 60-326
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Electron Physics Of Traveling Wave Tube Devices
Author(s): Whinnery, J. R., Sloan, D. H., Susskind, C., Birdsall, C. K., Aoki, Y., Everhart, T. E., Trivelpiece, A. W., Mueller, R.
Corporate Author(s): University Of California
Laboratory: Electronic Technology Laboratory
Date of Publication: 1960-07
Report number: WADD TR 60-471
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Effect Of Temperature On The Creep Of Polycrystalline Aluminum By The Cross-Sslip Mechanism
Author(s): Jaffe, N., Dorn, J. E.
Corporate Author(s): University Of California
Laboratory: Materials Central
Date of Publication: 1960-06
Report number: WADD TR 60-53